EUV
- Rigorous OPC and Source Optimization (presentation)
- Embedded Multilayer Mirror Defects (download a recent presentation)
- Arbitrary Defect Geometry (video)
- Inspect-ability
- Print-ability
- Off-axis Shadowing Effects, H-V bias (including Non-Constant Scattering Coefficients)
- Absorber Stack Analysis (EM-Stack video)
- Absorber Profile (sidewall & corner rounding) (video)
- Absorber Defects
- OPC for EUV (small area)
- Multilayer Mirror Structure (PSM)
Double Patterning
- Litho-Etch Litho-Etch
- Litho-Freeze Litho-Etch
- Sidewall Spacer
- Wafer topography effects (video)
- Non-planar resist
- Underlying features from 1st exposure
ArF/Immersion
- Rigorous mask modeling
- Rigorous OPC & Source Optimization (presentation)
- Laser Spectral Bandwidth Effects (video, presentation)
- polarization effects
- immersion bubble
- double exposure
- wafer topography (presentation)
Phase Shift Masks
- Alternating PSM: Intensity imbalance between shifed and unshifted openings
- Phase defects
- Wet etch/dual-trenching
- Chromeless Phase Lithography
- Attenuated Phase Shift Masks
Resist
- NTD with deprotection-shrinkage (presentation)
- SEM-induced shrinkage
- Stochastic effects at EUV & DUV
- PEB Diffusion Effects
- Surface Inhibition
- Temperature Effects
- Sidewall analysis
- Inner-Outer corner bias analysis
- Pull-back
- Top-loss
DUV Binary Masks
- OPC Verification
- Line-end shortening
- Iso-dense bias
GDS-II/Layout
- Rigorous/Scalar model-based OPC of small area
- Bias, Round, Manhattanize, Combine and Clip operations
- Import geometry
- Convert 2D pattern to 3D mask
Film Stack Analysis
- BARC Optimization
- Multilayer Mirror Reflectivity
- Resist thickness effects
Other
- Alignment Mark Simulation (presentation)
- Mask Inspection
- Wafer Inspection
- Scatterometry
- Grating Analysis (1D & 2D)
